Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-10-24
2006-10-24
Vinh, Lan (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C438S745000, C430S311000
Reexamination Certificate
active
07125495
ABSTRACT:
Two different processing techniques are utilized to respectively form high resolution features and low resolution features in a critical layer of an electronic device, and in particular a large area electronic device. High resolution features are formed by soft lithography, and low resolution features are formed by jet-printing or using a jet-printed etch mask. Jet-printing is also used to stitch misaligned structures. Alignment marks are generated with the features to coordinate the various processing steps and to automatically control the stitching process. Thin-film transistors are formed by generating gate structures using a first jet-printed etch mask, forming source/drain electrodes using soft lithography, forming interconnect structures using a second jet-printed etch mask, and then depositing semiconductor material over the source/drain electrodes. Redundant structures are formed to further improve tolerance to misalignment, with non-optimally positioned structures removed (etched) during formation of the low resolution interconnect structures.
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Chabinyc Michael L.
Salleo Alberto
Street Robert A.
Wong William S.
Bever Patrick T.
Bever Hoffman & Harms LLP
Palo Alto Research Center Inc.
Vinh Lan
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