Large area cathode lift-off sputter deposition device

Details Large area cathode lift-off sputter deposition device Large area cathode lift-off sputter deposition device

1987-10-29

1989-04-25

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 20419232, C23C 1434

Patent

active

048245445

ABSTRACT:
An etching/deposition system comprising a hollow cathode electron source in combination with a magnetron sputter deposition plasma device within a containment chamber, said hollow cathode being disposed to inject electrons into the magnetic field of the magnetron plasma device adjacent to the magnetron cathode surface to which a deposition source is affixed. Said system further includes means for initiating and maintaining a discharge plasma within the hollow cathode and for initiating and maintaining the magnetron plasma. The improvement of the invention comprises a workpiece to be coated, located in said chamber, spaced from said magnetron cathode surface which may be biased to attract particles emitted by said deposition source. A particle collimation filter is interposed between the magnetron cathode surface and said target sample but outside of said plasma region, which prevents any deposition particles from reaching said target sample which are not travelling in a direction substantially perpendicular thereto.

REFERENCES:
patent: 3410774 (1968-11-01), Barson et al.
patent: 3654110 (1972-04-01), Kraus
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patent: 3932232 (1976-01-01), Labuda et al.
patent: 4521286 (1985-06-01), Horwitz
patent: 4588490 (1986-05-01), Cuomo et al.
patent: 4661203 (1987-04-01), Smith et al.
patent: 4724060 (1988-02-01), Sakata et al.
IBM Technical Publication RC10976, Feb. 1985, Cuomo et al, entitled "Enhancement Plasma Processes".
J. Vac. Sci. Technol. A4(3), May/Jun. 1986, "Hollow-Cathode-Enhanced magnetron Sputtering," by Cuomo et al, pp. 393-396.
J. Vac. Sci. Technol. A4(1), Jan./Feb. 1986, "Erosion Profile of a Radio Frequency Planar Magnetron Sputtering Target with Aperture Shield," by Holdeman et al, pp. 137-138.
IBM Technical Publication RC11759, Mar. 1986, entitled "Lift-Off Deposition Techniques Using Sputtering" of Cuomo et al.

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