Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate
Patent
1997-06-06
1999-01-05
Medley, Margaret
Abrasive tool making process, material, or composition
With inorganic material
Clay, silica, or silicate
51309, 106 3, 510418, 510420, C08K 300
Patent
active
058556338
ABSTRACT:
Improved lapping slurries provide for easier and more thorough cleaning of alumina workpieces, as well as inhibit corrosion of the lapping table and provide for easier cleaning of the lapping equipment. The unthickened lapping slurry comprises abrasive grains such as diamond abrasive dispersed in a carrier comprising water, glycerine, and triethanolamine. The thickened lapping slurry comprises abrasive grains such as diamond abrasive dispersed in a carrier comprising water, glycerine, triethanolamine, a water soluble silicate, and acid.
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Leitten Michael E.
Simandl Ronald F.
Upchurch Victor S.
Davis J. Kenneth
Lockheed Martin Energy Systems, Inc.
Medley Margaret
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