Lapping plate for a lapping and polishing machine

Details Lapping plate for a lapping and polishing machine Lapping plate for a lapping and polishing machine

1990-10-09

1991-08-06

Rachuba, Maurika

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

511312, 51209R, 51266, 51267, B24B 500

Patent

active

050366254

ABSTRACT:
This invention relates to a complete double lap lapping and polishing machine particularly to an apparatus designed to finish to a required thickness and/or finished polish workpiece such as thin silicon and/or ceramic wafers. The machine includes improvements in all of it's substructure components, including it's overall housing design, planetary gear drive, fluid cooling systems, positioning and locking of the upper lap plate in an inoperative position, an automatic thickness or sizing control, rotary union with automatic fluid liquid indicator and a slurry delivery and recovery system, all of which result in a more automated efficient use of the machine so as to produce a closer tolerance finished product.

REFERENCES:
patent: 602365 (1898-04-01), Schulze et al.
patent: 3579916 (1971-05-01), Boettcher
patent: 3603042 (1971-09-01), Boettcher
patent: 3981105 (1976-09-01), Flaherty et al.
patent: 3992820 (1976-11-01), Suter
patent: 4471579 (1984-09-01), Bovensiepen
patent: 4502252 (1985-03-01), Iwabuchi
patent: 4593495 (1986-06-01), Kawakami et al.

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