Lapping machine

Details Lapping machine Lapping machine

1983-03-28

1985-03-05

Smith, James G.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

511312, 511314, 51132, 51215UE, B24B 500

Patent

active

045022526

ABSTRACT:
In a lapping apparatus, washing water is ejected from washing water holes toward a carrier holding wafers after the wafers are polished. Thus, the wafers are separated from the carrier and upper and lower polishing members. Then, the carrier is forced up above the upper polishing member by a pushing ring. The wafers left on the upper member are carried onto a table by a first sweeper of an automatic collecting device. The transferred wafers are arranged in a line along a second sweeper. Then, the second sweeper pushes and moves the wafers in the direction of their arrangement toward a cassette on one side of the table. The wafers are housed in holder portions in the cassette, and are then immersed, along with the cassette, in a pure water tank.

REFERENCES:
patent: 1465117 (1923-08-01), Dey
patent: 3443342 (1969-05-01), Schulz
patent: 3568371 (1971-03-01), Day et al.
patent: 3668813 (1972-06-01), Barragan
patent: 3691694 (1972-09-01), Goetz et al.
patent: 3889428 (1975-06-01), Steinegger et al.
patent: 3970471 (1976-07-01), Bankes et al.
E. Mendel et al., "Multiple-Water Free Polishing Part I, Machine Concepts", 1979, ECS.
E. Mendel et al., "Multiple Wafer Free Polishing Part II Process", 1979, ECS.
E. Mendel et al., "Pad Materials for Chemical Mechanical Polishing", 1979.

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