Abrading – Abrading process – Utilizing nonrigid tool
Patent
1998-10-07
2000-11-21
Eley, Timothy V.
Abrading
Abrading process
Utilizing nonrigid tool
451 36, 451178, 451285, 451286, B24B 100
Patent
active
061495069
ABSTRACT:
Lapping or polishing at high speeds with fine abrasive particles offer significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles. An improved lapping system comprises a lapper platen system comprising: a) a frame (e.g., having a total weight of at least 200 kg) supporting a work piece holder b) a rotatable platen having an abrasive surface comprising an abrasive sheet secured to said platen, said platen being capable of providing surface feet per minute speeds on in outer edge of at least about 1,500 surface feet per minute; and c) a work piece holder which is movable on said frame.
REFERENCES:
patent: 648264 (1900-04-01), Jacobson
patent: 1291572 (1919-01-01), Lorenz
patent: 1353966 (1920-09-01), Lorenz
patent: 1353967 (1920-09-01), Lorenz
patent: 1355345 (1920-10-01), Lorenz
patent: 1401832 (1921-12-01), Taylor
patent: 1414172 (1922-04-01), Brown
patent: 2854829 (1958-10-01), Porter
patent: 3182428 (1965-05-01), Hannon
patent: 3561164 (1971-02-01), Dunn
patent: 3841031 (1974-10-01), Walsh
patent: 4010583 (1977-03-01), Highberg et al.
patent: 4011689 (1977-03-01), Cozzini
patent: 4045919 (1977-09-01), Moritomo
patent: 4062152 (1977-12-01), Mehrer
patent: 4085549 (1978-04-01), Hodges
patent: 4194324 (1980-03-01), Bonora et al.
patent: 4336765 (1982-06-01), Coughlin
patent: 4403567 (1983-09-01), daCosta et al.
patent: 4481741 (1984-11-01), Bouladon et al.
patent: 4483703 (1984-11-01), Kellar et al.
patent: 4506184 (1985-03-01), Siddall
patent: 4511387 (1985-04-01), Kellar et al.
patent: 4567694 (1986-02-01), Sekiya et al.
patent: 4593495 (1986-06-01), Kawakami et al.
patent: 4620738 (1986-11-01), Schwartz et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 4707012 (1987-11-01), Takagi
patent: 4709508 (1987-12-01), Junker
patent: 4742651 (1988-05-01), Wittstock
patent: 4851749 (1989-07-01), Forrester
patent: 4860498 (1989-08-01), Gosis
patent: 4926493 (1990-05-01), Junker
patent: 4943148 (1990-07-01), Mondragon et al.
patent: 5029555 (1991-07-01), Dietrich et al.
patent: 5062384 (1991-11-01), Foley et al.
patent: 5109631 (1992-05-01), Biebesheimer et al.
patent: 5121572 (1992-06-01), Hilscher
patent: 5133285 (1992-07-01), Mahler et al.
patent: 5140774 (1992-08-01), Onodera
patent: 5197228 (1993-03-01), Sharkey, III et al.
patent: 5205077 (1993-04-01), Wittstock
patent: 5299393 (1994-04-01), Chandler et al.
patent: 5317836 (1994-06-01), Hasegawa et al.
patent: 5324012 (1994-06-01), Aoyama et al.
patent: 5374021 (1994-12-01), Kleinman
patent: 5414491 (1995-05-01), Bryant
patent: 5421768 (1995-06-01), Fujiwara et al.
patent: 5514025 (1996-05-01), Hasegawa et al.
patent: 5534073 (1996-07-01), Kinoshita et al.
patent: 5563683 (1996-10-01), Kamiya
patent: 5573448 (1996-11-01), Nakazima et al.
patent: 5576754 (1996-11-01), Korem
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5584749 (1996-12-01), Mitsuhashi et al.
patent: 5584898 (1996-12-01), Fulton
patent: 5613896 (1997-03-01), Haus et al.
patent: 5624304 (1997-04-01), Pasch et al.
patent: 5651724 (1997-07-01), Kimura et al.
patent: 5664990 (1997-09-01), Adams et al.
patent: 5665656 (1997-09-01), Jairath
patent: 5667433 (1997-09-01), Mallon
patent: 5672097 (1997-09-01), Hoopman
patent: 5690541 (1997-11-01), Dalke
patent: 5690545 (1997-11-01), Clowers et al.
patent: 5704827 (1998-01-01), Nishi et al.
patent: 5762544 (1998-06-01), Zuniga et al.
patent: 5800254 (1998-09-01), Motley et al.
patent: 5816891 (1998-10-01), Woo
patent: 5820448 (1998-10-01), Shamouilian et al.
patent: 5830045 (1998-11-01), Togawa et al.
patent: 5853317 (1998-12-01), Yamaoto
patent: 5857898 (1999-01-01), Hiyama et al.
patent: 5860847 (1999-01-01), Sakurai et al.
patent: 5910041 (1999-06-01), Duescher
Berry Jr. Willie
Eley Timothy V.
Keltech Engineering
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