Abrading – Abrading process – Glass or stone abrading
Patent
1996-02-09
1998-02-17
Morgan, Eileen P.
Abrading
Abrading process
Glass or stone abrading
451 56, 451285, 451287, 451443, 1566361, 437228, B24B 5300
Patent
active
057186189
ABSTRACT:
A method and apparatus for planarizing photoresist and/or metal microstructure layers is provided. Planarization is achieved by removing material from a workpiece by lapping using a diamond containing lapping slurry. A lapping machine is furnished with a lapping plate made of a soft metal material. The lapping plate is furnished with ridges of controlled height using a diamond conditioning ring with a specified grit size. Free diamonds in a liquid slurry are then sprayed onto the plate and embedded therein by a second conditioning ring. After the lapping plate is conditioned, the piece to be lapped is mounted on the lapping plate. A vacuum hold fixture or flat steel or glass mounting plate may be used. During lapping, additional diamond slurry is sprayed onto the lapping plate and driven into the plate by a ceramic conditioning ring. The size of diamonds in the diamond slurry are selected to control the shear forces applied to the surface being lapped and to achieve a desired surface finish. Polishing, using a cloth covered hard metal polishing plate and loose diamond slurry, may be employed after lapping to provide a smooth optical surface finish. The lapping and polishing method and apparatus of the present invention may be used for z-dimension height control, re-planarization, and surface finishing of precise single or multiple level photoresist-metal layers, or of individual preformed photoresist sheets or laminates thereof.
REFERENCES:
patent: 4879258 (1989-11-01), Fisher
patent: 5189777 (1993-03-01), Guckel et al.
patent: 5190637 (1993-03-01), Guckel
patent: 5206983 (1993-05-01), Guckel et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5327033 (1994-07-01), Guckel et al.
patent: 5357807 (1994-10-01), Guckel et al.
patent: 5378583 (1995-01-01), Guckel et al.
patent: 5496668 (1996-03-01), Guckel et al.
patent: 5531635 (1996-07-01), Mogi et al.
patent: 5547417 (1996-08-01), Breivogel et al.
Guckel, H., et al., "Fabrication of Assembled Micromechanical Components via Deep X-Ray Lithography," Proceedings of IEEE Micro Electro Mechanical Systems, Jan. 30-Feb. 2, 1991, pp. 74-79.
Hagmann and W. Ehrfeld, "Fabrication of Microstructures of Extreme Structural Heights by Reaction Injection Molding," International Polymer Processing IV, vol. 3, 1989, pp. 188-195.
Guckel, H., et al., "Deep X-Ray and UV Lithographies for Micromechanics," Technical Digest, Solid State Sensor and Actuator Workshop, Hilton Head, S.C., Jun. 4-7, 1990, pp. 118-122.
Ehrfeld, W., et al., "LIGA Process: Sensor Construction Techniques Via X-Ray Lithography," Technical Digest IEEE Solid-State Sensor and Actuator Workshop, 1988, pp. 1-4.
Guckel, H., et al., "Processing and Design Considerations for High Force Output--Large Throw Electrostatic, Linear Micro Actuators," Actuator 94, Bermen, West Germany, Jun. 15-17, 1994, pp. 1-4.
Guckel Henry
Mangat Pawitterjit S.
Morgan Eileen P.
Wisconsin Alumni Research Foundation
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