Lapping and polishing apparatus

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

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Details

B24B 700

Patent

active

039786226

ABSTRACT:
Apparatus for abrading workpieces, particularly semiconductor wafers, characterized in that the workpiece is disposed on an abrading material in a lapping and polishing tray carried on a generally horizontal support plate. The plate is caused to oscillate or eccentrically rotate by a single, centrally located eccentric arm, the plate being restrained against rotary movement about the eccentric arm by resilient means which extend between stationary pins arranged around the support plate and points on the support plate intermediate the pins.

REFERENCES:
patent: 2192233 (1940-03-01), Mack
patent: 2412141 (1946-12-01), Ford
patent: 3061981 (1962-11-01), Banta
patent: 3277610 (1966-10-01), Mazur

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