Lapped hardboard panels and method

Details Lapped hardboard panels and method Lapped hardboard panels and method

1988-11-18

1992-02-25

Scherbel, David A.

Static structures (e.g., buildings)

With synthetic resinous component

Foam

162109, 52521, 52536, D21J 118

Patent

active

050901737

ABSTRACT:
A hardboard lapped siding panel of wet processed wood fibers with substantial variations in density to provide a desired combination of improved characteristics. The panel is molded from a mat of wet wood fibers between a pair of heated upper and lower contoured plates. The upper plate is contoured to form the desired configuration of the front surface of the siding panel. The lower plate is contoured to provide the desired variations in density other improved characteristics of the panel. Preferably, the mat is molded on an underlying wire screen with a contour which is essentially the same as the contour of the lower plate.

REFERENCES:
patent: 4279106 (1981-07-01), Gleason et al.
patent: 4726881 (1988-02-01), Schultz

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