Land grid array with socket plate

Details Land grid array with socket plate Land grid array with socket plate

2006-10-03

2006-10-03

Zarroli, Michael C. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S070000

Reexamination Certificate

active

07114959

ABSTRACT:
A grounded conductive plate in a land grid array package assembly includes a plurality of openings. The openings allow contacts from the socket to pass through to contact a package. The diameter of each opening is customizable to produce desired impedance between the contacts and the conductive plate. Impedance discontinuity seen by signals passing through the socket may be reduced.

REFERENCES:
patent: 5481436 (1996-01-01), Werther
patent: 5518410 (1996-05-01), Masami
patent: 5536181 (1996-07-01), Karnavas
patent: 6561820 (2003-05-01), Stone et al.
patent: 6776624 (2004-08-01), Suematsu
patent: 6791171 (2004-09-01), Mok et al.
patent: 2004/0253845 (2004-12-01), Brown et al.

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