Land grid array structures and methods for engineering change

Details Land grid array structures and methods for engineering change Land grid array structures and methods for engineering change

2008-04-29

2008-04-29

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Repairing

C029S402010, C029S402130, C029S842000, C439S066000

Reexamination Certificate

active

11414020

ABSTRACT:
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both, using a removable and restorable engineering change plug.

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