Land grid array structures and methods for engineering change

Details Land grid array structures and methods for engineering change Land grid array structures and methods for engineering change

2006-07-18

2006-07-18

Paumen, Gary F. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S070000

Reexamination Certificate

active

07077660

ABSTRACT:
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

REFERENCES:
patent: 4549200 (1985-10-01), Ecker et al.
patent: 4652974 (1987-03-01), Ryan
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4819131 (1989-04-01), Watari
patent: 5060116 (1991-10-01), Grobman et al.
patent: 5177594 (1993-01-01), Chance et al.
patent: 5243140 (1993-09-01), Bhatia et al.
patent: 5480309 (1996-01-01), Arisaka
patent: 5659953 (1997-08-01), Crane et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 6239485 (2001-05-01), Peters et al.
patent: 6388207 (2002-05-01), Figueroa et al.
patent: 6428327 (2002-08-01), Tamarkin et al.
patent: 6471525 (2002-10-01), Fan et al.
patent: 6521842 (2003-02-01), Brinthaupt et al.
patent: 6794581 (2004-09-01), Smith et al.
patent: 6847529 (2005-01-01), Dibene et al.

Affiliated with

Also associated with

Rating

Land grid array structures and methods for engineering change does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Land grid array structures and methods for engineering change, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Land grid array structures and methods for engineering change will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3537240