Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-08-01
2006-08-01
Duverne, J. F. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07083430
ABSTRACT:
A land grid array socket includes an insulative housing (2), a stiffener (4) partly covering and reinforcing the housing, a metal clip (5) pivotably engaged on one end of the stiffener, and a lever (6) mounted on two opposite ends of the stiffener for fastening the clip onto the housing. The housing includes a floor (20), a number of sidewalls (24, 26) extending upwardly from the floor and a receiving space defined between the bottom wall and the sidewalls. A pair of step (263) is formed on the floor, for sustaining the LGA package (3) thereon. The sidewall that is far from the clip defines a plurality of rigid blocks (2683) in an inner side for resisting scrape between the sidewall and the LGA package. Therefore, the sidewall of the housing can be protected from scraping damage during insertion of the LGA package into the housing.
REFERENCES:
patent: 6574109 (2003-06-01), McHugh et al.
patent: 6722909 (2004-04-01), McHugh et al.
patent: 2004/0142584 (2004-07-01), Ma
Liao Fang-Jwu
Szu Ming-Lun
Chung Wei Te
Duverne J. F.
Hon Hai - Precision Ind. Co., Ltd.
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