Land grid array socket with reinforcing plate

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Details

C439S264000, C439S330000, C439S525000, C439S526000

Reexamination Certificate

active

06832919

ABSTRACT:

BACKGROUND OF INVENTION
1. Field of the Invention
The present invention relates to electrical connectors, and more particularly to a land grid array (LGA) socket for electrically connecting a land grid array (LGA) package to a printed circuit board (PCB).
2. Description of Related Art
An integrated circuit (IC) package having contact pads arranged on a bottom surface thereof in a land grid array (LGA) is known as an LGA package. LGA packages have relatively low height, which saves valuable space in electronic assemblies.
Connectors for removably mounting an LGA package on a PCB are known as LGA sockets. An LGA socket assembly typically comprises an insulative housing, which is positioned between the LGA package and the PCB. The housing defines an array of passageways receiving electrical contacts therein. The contacts correspond with the array of contact pads of the LGA package. Each contact has a pair of opposite free ends that project beyond opposite external surfaces of the housing. Prior to mounting of the LGA package, the free ends are spaced apart a predetermined distance. The free ends are respectively engaged with corresponding contact pads of the LGA package, and soldered to contact pads on a mounting surface of the PCB. The LGA package is positioned on the housing, and the contact pads of the LGA package rest on the contacts of the housing. Thereupon, it is necessary to exert a force upon the LGA package to maintain firm electrical connection between the contacts pads of the LGA package and the respective contacts of the housing. The force is powerful enough to maintain the electrical connection between the contacts pads and the contacts.
Various LGA sockets comprising a cover slidably mounted on the housing to provide the force are disclosed in, for example, U.S. Pat. Nos. 4,504,105, 4,621,884, 4,692,790, 5,302,853, and 5,344,334. Referring to
FIG. 1
, a typical such LGA socket
9
comprises a cover
93
and a metallic lever
92
respectively mounted to opposite ends of a housing
91
. The end of the housing
91
mounted with the cover
93
defines a pair of troughs mating with a pair of corresponding hooks extending from an end of the cover
93
. The opposite end of the housing
91
forms a pair of braces holding the lever
92
. A pair of protuberances
911
is respectively defined on the surfaces of the braces, the protuberances
911
holding the lever
92
in a horizontal position.
The housing
91
and the protuberances
911
are made of plastic, and the protuberances
911
wear out after repeated use of the lever
92
. When the protuberances
911
have become too small, they can no longer reliably retain the lever
92
. Opposite lateral sides of the cover
93
are bent slightly downwardly to form a pair of clasping portions. When the LGA socket
9
is not in use, the cover
93
is rotated down onto the housing
91
, and the clasping portions rest on a top surface of the housing
91
.
In use, an LGA package
8
is positioned on the housing
91
. The cover
93
is rotated down onto the LGA package
8
, with the clasping portions resting on the LGA package
8
. The lever
92
is rotated down, and engages with a free end of the cover
93
. The lever
92
thus presses the clasping portions of the cover
93
onto the LGA package
8
.
Because the lever
92
presses down on the cover
93
, and the clasping portions of the cover
93
press down on the LGA package
8
, the lever
92
simultaneously pulls up the end of the housing
91
thereat to counterbalance the pressing forces. In addition, the hooks of the cover
93
tend to pull up the end of the housing
91
thereat, to counterbalance the pressing forces of the clasping portions of the cover
93
.
Generally, the force required for the clasping portions of the cover
93
to firmly retain the LGA package
8
thereunder is considerable. Accordingly, the pressing force applied by the lever
92
on the cover
93
is also considerable. The result is that the pulling up force of the lever
92
is considerable, and the pulling up force of the cover
93
is also considerable.
Said pulling up forces operate on the opposite ends of the housing
91
respectively, and the pressing forces of the clasping portions of the cover
93
operate to press a center portion of the housing
91
downward. Because the housing
91
is made of plastic, it has limited rigidity. As a result, the opposite ends of the housing
91
tend to bend upward. The forces applied by the clasping portions of the cover
93
on the LGA package
8
are decreased. The upshot is that firm and reliable electrical connection between the contacts pads of the LGA package
8
and the contacts of the housing
91
is diminished.
SUMMARY OF INVENTION
It is therefore an object of the present invention to provide an LGA socket for electrically connecting a land grid array (LGA) package to a printed circuit board (PCB), wherein contacts pads of the LGA package can be firmly and reliably connected with respective contacts of the LGA socket.
To achieve the above object, an LGA socket assembly of the present invention is provided for electrically connecting a land grid array (LGA) package to a printed circuit board (PCB) The LGA socket comprises a slab like insulative housing, a reinforcing plate attached on an exterior surface of the housing, and a clip and a lever. The clip and the lever are respectively mounted on two opposite ends of the housing to fasten an LGA package. The lever includes a driver portion, a driven portion adjoining the driver portion, and a baffle extending from a side of the reinforcing plate. The baffle prevents the lever from breaking away from the housing. After the LGA package is positioned on the housing, the rigidity of the housing is improved with the reinforcing plate made of rigid material being equipped on the housing. Steady electrical connection between the contacts pads of the LGA package and respective contacts of the housing is ensured.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 4504105 (1985-03-01), Barkus et al.
patent: 4621884 (1986-11-01), Berkebile, Jr. et al.
patent: 4692790 (1987-09-01), Oyamada
patent: 5302853 (1994-04-01), Volz et al.
patent: 5344334 (1994-09-01), Laub et al.
patent: 5761036 (1998-06-01), Hopfer et al.
patent: 6692279 (2004-02-01), Ma

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