Land grid array socket with pressing plate

Details Land grid array socket with pressing plate Land grid array socket with pressing plate

2006-08-01

2006-08-01

Hyeon, Hae Moon (Department: 2839)

Electrical connectors

With coupling movement-actuating means or retaining means in...

For dual inline package

C439S342000

Reexamination Certificate

active

07083457

ABSTRACT:
A new land grid array socket (LGA,100) provided according to a preferred embodiment of the LGA socket includes a base for receiving an integrated circuit (IC) package (200), a number of terminals (40) secured on the base, a pressing mechanism moveably attached on the base and being formed with at least one pressing portion (570) to securely press the IC package on the base. The at least one pressing asymmetrically pressingly engages with the IC package, thereby assuring uniform electrical engagement between the IC package and the terminals.

REFERENCES:
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patent: 6485320 (2002-11-01), Ma
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patent: 6676429 (2004-01-01), McHugh et al.
patent: 6699047 (2004-03-01), McHugh et al.
patent: 6776642 (2004-08-01), McHugh et al.
patent: 6914192 (2005-07-01), Ju
patent: 6916195 (2005-07-01), Byquist
patent: 2004/0095693 (2004-05-01), Shirai et al.

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