Land grid array socket having improved terminals

Details Land grid array socket having improved terminals Land grid array socket having improved terminals

2007-02-27

2007-02-27

Patel, Tulsidas C. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S091000

Reexamination Certificate

active

11027723

ABSTRACT:
A land grid array socket (1) in accordance with the present invention is provided. The socket comprises an insulative housing (2) having a plurality of passageways (24) extending throughout an upper mating surface (22) and a lower mounting surface (20). A plurality of electrical terminals (3) are received in corresponding passageways, each terminal comprises a first part (32) having a first spring arm (322) extending out of the upper mating surface for electrically connected to an IC chip (4) and a second spring arm (306) extending out of the lower mounting surface for electrically connected to a motherboard (5). The first part and the second part are accommodated in a same passageway and separate from each other while interconnected by a third spring arm (304) settled therebetween.

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patent: 6843659 (2005-01-01), Liao et al.
patent: 6881070 (2005-04-01), Chiang

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