Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-12-19
2006-12-19
Dinh, Phuong (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07150632
ABSTRACT:
A land grid array socket (1) comprises an insulative housing (11) having a plurality of passageways (113) extending throughout a top surface (111) and an opposite bottom surface (113) and a plurality of electrical terminals (5) received in corresponding passageways, respectively. Each terminal including a base portion (51) in the passageway and a first spring arm (55) extending out of the top surface of the housing and adapted to be electrically connected with a first electronic component (2) and a second spring arm (54) extending out of the bottom surface of the housing and adapted to be electrically connected with a second electronic component (3). Wherein the first and the second spring arms each has a resisting portion (531, 521), the resisting portions resist the base portion when the spring arms are pressed by the first and the second electronic components so as to form a shorter electrical circuit path between the electronic components.
REFERENCES:
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 5984693 (1999-11-01), McHugh et al.
patent: 6957964 (2005-10-01), Chiang
patent: 2004/0266225 (2004-12-01), Chiang
Chen Li-Chen
Huang Yao-Chi
Lee Genn-Sheng
Chung Wei Te
Dinh Phuong
Hon Hai - Precision Ind. Co., Ltd.
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