Land grid array socket having improved terminals

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Details

C439S515000

Reexamination Certificate

active

07090504

ABSTRACT:
A land grid array (LGA) socket is adapted to receive an IC module (40) and mounted on a PCB (50). The socket (1) includes an insulative housing (30) having a plurality of passageways (302) and a plurality of electrical terminals (10) received in the passageways. Each of the terminals includes a retention portion (12), a pressing arm (16) bent slantwise and extending upwardly from an end of the retention portion, and a contacting ann (18) bent slaniwise and extending downwardly from another end of the retention portion. At least one connecting plate (14) connects the pressing urn and the contacting arm, the connecting plate is separate from the retention portion, thereby decreasing impedance of the terminal.

REFERENCES:
patent: 4655519 (1987-04-01), Evans et al.

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