Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-08-15
2006-08-15
Nasri, Javaid H. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S515000
Reexamination Certificate
active
07090504
ABSTRACT:
A land grid array (LGA) socket is adapted to receive an IC module (40) and mounted on a PCB (50). The socket (1) includes an insulative housing (30) having a plurality of passageways (302) and a plurality of electrical terminals (10) received in the passageways. Each of the terminals includes a retention portion (12), a pressing arm (16) bent slantwise and extending upwardly from an end of the retention portion, and a contacting ann (18) bent slaniwise and extending downwardly from another end of the retention portion. At least one connecting plate (14) connects the pressing urn and the contacting arm, the connecting plate is separate from the retention portion, thereby decreasing impedance of the terminal.
REFERENCES:
patent: 4655519 (1987-04-01), Evans et al.
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Nasri Javaid H.
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