Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1995-12-28
1997-12-30
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439526, H05K 100
Patent
active
057022569
ABSTRACT:
A socket for coupling one of a first integrated circuit module having a first footprint and a first terminal array, or a second integrated circuit module having a second larger footprint to a printed circuit board. A socket base has a top surface for receiving one of the first and second integrated circuit modules and a bottom surface adapted to be mounted on a printed circuit board. A first array of contacts extends transversely through the base from the top surface to the bottom surface for electrically coupling the first terminal array to the printed circuit board. An alignment feature coupled to the base, is configured to align one of the first or second integrated circuit modules within the socket base such that the terminals of either the first or second integrated circuit modules engage the contact array, the second integrated circuit module extending beyond the alignment feature when aligned in the socket.
REFERENCES:
patent: 4554505 (1985-11-01), Zachry
patent: 5215472 (1993-06-01), DelPrete et al.
Faatz Cynthia Thomas
Goins Christopher
Intel Corporation
Paumen Gary F.
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