Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-03-27
2008-12-23
Paumen, Gary F. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07467949
ABSTRACT:
A land grid array socket (10) includes a dielectric housing (12) defining a number of passages (122) and a number of conductive terminals (16) residing in the corresponding passages, respectively. Each conductive terminal includes a base section (1600) secured to the passage and a pair of opposing bent sections (162) angularly stretching out from lateral sides of the base section. The bent sections each include a resilient arm (164) protruding upwardly and obliquely out of the housing to resiliently and electrically mate with an electronic component coupled thereto.
REFERENCES:
patent: 1477527 (1923-12-01), Raettig
patent: 6186797 (2001-02-01), Wang et al.
patent: 6488513 (2002-12-01), Neidich et al.
patent: 6540526 (2003-04-01), Toda
patent: 6843659 (2005-01-01), Liao et al.
patent: 7150632 (2006-12-01), Lee et al.
patent: 7156706 (2007-01-01), Brown et al.
patent: 2002/0081870 (2002-06-01), Toda
patent: 2004/0192081 (2004-09-01), Koopman et al.
patent: 2005/0020146 (2005-01-01), McAlonis et al.
patent: 2005/0233606 (2005-10-01), Lee et al.
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Paumen Gary F.
LandOfFree
Land grid array socket does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Land grid array socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Land grid array socket will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4048471