Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-12-27
2008-09-23
Gushi, Ross N (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07427203
ABSTRACT:
According to one embodiment of the present invention, a land grid array socket includes an insulative housing (30) defining a number of passages (35) and a number of conductive terminals (20) residing in corresponding passages, respectively. Each terminal includes a base section (21) secured in the passage and a pair of opposing bent sections (23, 24) angularly stretching out from two sides of the base section. The bent sections each include a pair of resilient arms (25) protruding upwardly out of the housing, so as to provide multiple contacting points between the terminal and an electronic component seated thereon.
REFERENCES:
patent: 5139427 (1992-08-01), Boyd et al.
patent: 6186797 (2001-02-01), Wang et al.
patent: 6488513 (2002-12-01), Neidich et al.
patent: 6638119 (2003-10-01), Chang
patent: 6843659 (2005-01-01), Liao et al.
patent: M274681 (2005-09-01), None
Chung Wei Te
Gushi Ross N
Hon Hai Precision Ind. Co. Ltd
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