Land grid array package/circuit board assemblies and methods for

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

174 524, 361768, 361789, 439 66, 439 91, H05K 720

Patent

active

054735106

ABSTRACT:
An electrical assembly 100 is provided which includes a land grid array integrated circuit package 103, a socket 104, a printed circuit board 106 and a clamping lid 101. Socket 104 and clamping lid 101 have major surface dimensions no greater than the major surface dimensions of the LGA integrated circuit package 103 in order to limit board space requirements to the minimum required by the circuit package 103. Alignment means associated with integrated circuit package 103, socket 104 and printed circuit board 106 are provided to maintain alignment between contact pads 120 on circuit package 103 and first ends of compressible conductors 111 on socket 104 and between contact pads 122 on circuit board 106 and second ends of compressible conductors 111. In the completed assembly, clamping lid 101 applies pressure to an adjacent surface of integrated circuit package 103 thereby compressing compressible conductors 111 against contact pads 120 and contact pads 122.

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