Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2002-12-18
2003-09-30
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S331000
Reexamination Certificate
active
06626683
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention is related to an integrated circuit socket, and more particularly to a land grid array or ball grid array type integrated circuit socket.
2. Description of the Prior Arts
Depending on the structure, the terminals of integrated circuit, especially central processor unit (CPU), can be divided into three types of pin grid array (P.G.A.), ball grid array (B.G.A.) and land grid array (L.G.A.).
U.S. Pat. No. 5,456,613 discloses a socket structure specifically for the P.G.A. type integrated circuit. The terminal of P.G.A. type integrated circuit is considerably long. Therefore, very high conductive members are inlaid in a very thick insulating socket to respectively electrically contact with the terminal of the P.G.A. type integrated circuit and the contacts of the printed circuit board. Accordingly, the socket structure specifically for the P.G.A. type integrated circuit has a considerable thickness.
The B.G.A. type integrated circuit has been developed for shortening the length of the terminal. As shown in
FIGS. 58
to
61
, the long leg terminal of the P.G.A. type integrated circuit is changed into ball grid, for example, tin ball or copper ball. This greatly shortens the length of the terminal of the integrated circuit. U.S. Pat. No. 5,419,710 discloses a socket specifically for the B.G.A. type integrated circuit.
In order to further simplify the terminal of the integrated circuit, L.G.A. type integrated circuit has been developed recently. As shown in
FIGS. 62
to
65
, the terminal of the integrated circuit is changed into flat plane land grid so as to simplify the structure and lower the manufacturing cost and achieve better contact and conductive effect. U.S. Pat. Nos. 5,192,213, 5,199,889, 5,232,372, 5,320,559, 5,362,241 and 5,389,819 disclose various sockets specifically for the L.G.A. type integrated circuit.
In order to minify the area of the integrated circuit, the pitch between each two adjacent terminals has been more and more reduced. Presently, the mostly seen pitch is 1.27 mm. In such narrow pitch, it is hard to insert conductive members. In the case that the conductive member is further required to have sufficient up and down resilience, the extensible resilient section of the conductive member can only extend in a direction perpendicular to the face of the terminal of the integrated circuit. Therefore, the existent sockets all have quite thick thickness.
In addition, the resilient section extending in the direction perpendicular to the face of the terminal of the integrated circuit has complicated structure and fails to have sufficient up and down resilience under limitation of the 1.27 mm pitch.
Furthermore, due to manufacturing tolerance, the contact ends of the respective conductive members in contact with the integrated circuit are inevitably ununified. When pressing the integrated circuit to make the terminals thereof contact with the contact ends of the conductive members, the resilient sections of the conductive members are compressed and contracted by the integrated circuit only to a limited extent. Therefore, some of the terminals of the integrated circuit fail to truly contact with the conductive members of the socket. This leads to problem of poor contact.
SUMMARY OF THE INVENTION
It is therefore a primary object of the present invention to provide a land grid array or ball grid array type integrated circuit socket in which the resilient section of the conductive member integrally obliquely or windingly transversely extends from the inlay section. When the conductive member is compressed by the integrated circuit into a final contact position, the projection length of the resilient section on the face of the insulating board is larger than the pitch between any two adjacent terminals of the integrated circuit. Therefore, the resilient section of the conductive member is not limited by the extremely small pitch such as 1.27 mm pitch. Therefore, the resilient section can have longer length and greater resilience, while having not high height. Therefore, the resilient section can better and more truly contact with the terminal of integrated circuit.
It is a further object of the present invention to provide the above land grid array or ball grid array type integrated circuit socket in which the resilient section of the conductive member has the above special structure so that the manufacturing tolerance of the terminals of the integrated circuit and the tolerance resulting from the bending and deformation of the integrated circuit when pressed into the socket can be absorbed. Therefore, the contact ends of every conductive members can fully and reliably contact with every terminals of the integrated circuit.
It is still a further object of the present invention to provide the above land grid array or ball grid array type integrated circuit socket in which the resilient section of the conductive member has the above special structure so that the entire socket becomes thinner and has stronger structure and it is ensured that the insulating board of the socket be not deformed.
It is still a further object of the present invention to provide the above land grid array or ball grid array type integrated circuit socket which achieves a good shielding effect to avoid leakage of electromagnetic wave generated by the integrated circuit and meet the standard of shielding of electromagnetic interference (EMI).
According to the above objects, the land grid array or ball grid array type integrated circuit socket of the present invention includes: a metal basin which is a box body having a bottom face and multiple side walls, two opposite side walls of the metal basin being respectively formed with latch perforations, each latch perforation having an opening section and a latch section communicating with the opening section; an insulating board snugly inlaid in the metal basin, the insulating board having multiple insertion holes passing through the insulating board; multiple conductive members which are one by one inlaid in the insertion holes of the insulating board and passed through the metal basin to contact with multiple corresponding land grid array conductive contacts of a circuit board and contact with multiple land grid array or ball grid array terminals of the integrated circuit, whereby the conductive contacts of the circuit board are electrically connected with the terminals of the integrated circuit; an upper cover having a first side, a second side opposite to the first side, a third side connected with one end of the first side and second side and a fourth side connected with the other end of the first side and second side, the upper cover further including multiple latch tenons which are disposed on the first and second sides and can be correspondingly placed into the opening section of the latch perforation of the metal basin and latched in the latch section, whereby the upper cover is latched on the metal basin to cover upper side thereof, the upper cover having a receiving section for accommodating the integrated circuit therein, the receiving section including: a first locating section disposed on the first side, the first locating section being integrally downward bent from the upper cover and protruding from the bottom face of the upper cover, whereby when the integrated circuit is attached to the bottom face of the upper cover, the first locating section is adjacent to a first edge of the integrated circuit; a second locating section disposed on the second side, the second locating section being integrally downward bent from the upper cover and protruding from the bottom face of the upper cover, the second locating section being adjacent to a second edge of the integrated circuit; a third locating section disposed on the third side, the third locating section being integrally downward bent from the upper cover and protruding from the bottom face of the upper cover, whereby when the integrated circuit is attached to the bottom face of the upper cover, the third locating
Rosenberg , Klein & Lee
Ta Tho D.
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