Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-04-24
2007-04-24
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE25023, C257S723000, C257S685000, C257S777000, C438S108000, C438S109000, C361S760000
Reexamination Certificate
active
11100151
ABSTRACT:
Disclosed is a land grid array module comprising: a substrate; a plurality of active and passive components mounted on both sides of the substrate; and a molding compound for encapsulating the both sides of the substrate with the active and passive components mounted thereon. The land grid array module mounts the passive and active components on both sides of the substrate, thereby improving the integration of the circuit device. Also, the use of a thin film printed circuit board or a flexible printed circuit board with high rigidity as the substrate reduces the overall thickness of the land grid array module.
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Kwak Kyu-Sub
Lee Young-Min
Cha & Reiter L.L.C.
Chu Chris C.
Parker Kenneth
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