Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-09-05
2008-11-04
Paumen, Gary F. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07445463
ABSTRACT:
In a land grid array connector for electrically connecting a chip module to a printed circuit board, comprising: an insulative housing and a plurality of contacts, the housing including side walls and a central portion surrounded by the side walls, the central portion having a first mounting face toward the chip module, a second mounting face toward the printed circuit board, and a plurality of grooves receiving the contacts, at least two of the side walls each including a spring arm extending into the central portion, the improvement wherein a protrusion is disposed on at least one of the spring arm and the associated side wall.
REFERENCES:
patent: 6746253 (2004-06-01), Ma
patent: 6821163 (2004-11-01), McHugh et al.
patent: 7128580 (2006-10-01), Liao et al.
patent: 2005/0014398 (2005-01-01), Liao et al.
patent: 2005/0245108 (2005-11-01), Liao et al.
Huang Yao-Chi
Peng Fu-Jing
Tang Qing-Yi
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Paumen Gary F.
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