Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-05-28
2004-05-04
Martin, David (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S785000, C439S066000, C439S071000
Reexamination Certificate
active
06731516
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to land grid array (LGA) connectors, and particularly to an LGA connector for electrically connecting an electronic package such as an LGA central processing unit (CPU) with a circuit substrate such as a printed circuit board (PCB), wherein the LGA connector movably engages a number of electrical contacts therein.
2. Description of the Prior Art
At present, LGA connectors are widely used to electrically connect LGA CPUs with PCBs. A typical LGA connector is disclosed in Taiwan Patent No. 444960. Referring to
FIGS. 8 through 10
, a conventional LGA connector
6
comprises an insulative housing
61
, and a multiplicity of electrical contacts
62
received in the housing
61
. The housing
61
is substantially rectangular, and defines a rectangular cavity
63
in a middle thereof for receiving an LGA CPU
8
therein. A portion of the housing
61
under the cavity
63
defines a multiplicity of passageways
631
therethrough. Each passageway
631
includes a pair of aligned slots
6310
in a middle thereof. The contacts
62
engage with the housing
61
in the corresponding slots
6310
of the passageways
631
, respectively. Each contact
62
comprises an engaging portion
623
, a contact portion
621
extending from an end of the engaging portion
623
, and a solder portion
622
extending from another end of the engaging portion
623
. A solder ball
624
is electrically mounted to the solder portion
622
by welding. The engaging portion
623
has a number of protrusions
6230
. The protrusions
6230
of the contacts
62
interferentially engage the housing
61
at the corresponding slots
6310
, such that the contacts
62
are secured in the housing
61
. The contact portions
621
protrude out from a top surface
610
of the housing
61
, and the solder balls
624
project down beyond a bottom surface
611
of the housing
61
. Therefore, the contact portions
621
are liable to be accidentally damaged, particularly during shipping of the LGA connector
6
.
In use, the LGA connector
6
is mounted to a PCB
9
, with the solder balls
624
electrically connected with the PCB
9
. The CPU
8
is mounted in the cavity
63
of the LGA connector
6
. A force is applied to press the CPU
8
downwardly. Such force may be transmitted by another component such as a retention module (not shown). The contact portions
621
of the contacts
62
deform elastically such that the contact portions
621
firmly electrically connect with the CPU
8
. The LGA connector
6
thus electrically connects the CPU
8
with the PCB
9
. In this state, the solder balls
624
of the LGA connector
6
sustain the pressure applied from the retention module, and the solder balls
624
are liable to be damaged thereby. When any one or more of the solder balls
624
are damaged, the electrical connection between the CPU
8
and the PCB
9
is liable to be disrupted.
In view of the above, a new LGA connector that overcomes the above-mentioned disadvantages is desired.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a land grid array (LGA) connector for electrically connecting an LGA central processing unit (CPU) with a printed circuit board (PCB), and particularly to an LGA connector which can be safely shipped.
Another object of the present invention is to provide a land grid array (LGA) connector for electrically connecting an LGA central processing unit (CPU) with a printed circuit board (PCB), and particularly to an LGA connector which has a housing configured to minimize the risk of solder balls being broken in use.
To achieve the above-mentioned objects, an LGA connector in accordance with a preferred embodiment of the present invention comprises an insulative housing, and a multiplicity of electrical contacts received in the housing. The housing is substantially rectangular, and has a plurality of stand-offs at a bottom surface thereof. Two aligned of the stand-offs at one side of the bottom surface are parallel to another of the stand-offs at an opposite side of the bottom surface. A rectangular cavity is defined in a middle of the housing for receiving an LGA CPU therein. A multiplicity of passageways is defined in a portion of the housing under the cavity. Each passageway includes a slot at an end thereof. The contacts engage with the housing in the slots respectively. Each contact comprises an engaging portion for engaging in the slot of one of passageways of the housing, a contact portion accommodated within the passageways, and a solder portion. A solder ball is mounted to the solder portion for electrically connecting with a PCB by welding. In use, a force is applied to press the CPU downwardly. The CPU presses the housing downwardly, and the engaging portion of each contact slides upwardly in the corresponding slot relative to the housing until the stand-offs make contact with a top surface of the PCB. The contact portion deforms elastically to firmly electrically connect with the CPU. The LGA connector thus reliably electrically connects the CPU with the PCB.
REFERENCES:
patent: 5653598 (1997-08-01), Grabbe
patent: 6146152 (2000-11-01), McHugh et al.
patent: 6203331 (2001-03-01), McHugh et al.
patent: 6210176 (2001-04-01), Hsiao
patent: 6220870 (2001-04-01), Barabi et al.
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Martin David
Phan Thanh S.
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