Electric lamp and discharge devices – With envelope – Having base and connector
Reexamination Certificate
2005-09-23
2010-06-29
Roy, Sikha (Department: 2879)
Electric lamp and discharge devices
With envelope
Having base and connector
C313S318120, C313S047000, C313S025000, C313S027000, C362S548000, C362S549000, C362S647000
Reexamination Certificate
active
07745982
ABSTRACT:
The invention relates to a lamp socket1for lamps25, in particular vehicle lamps, comprising a connection region2for arranging the lamps25on a headlamp, a light or the like, a hollow-cylindrical receiving section3for arranging a bulb27on the lamp socket1, and a cylindrical metal sleeve4which is arranged in the receiving section3. In order to provide a lamp socket1of simple and stable design which has high heat-resistance, it is provided that a flange5arranged on the metal sleeve4rests on protrusions7which project from an upper edge6of the receiving section3.
REFERENCES:
patent: 4337508 (1982-06-01), Moffatt
patent: 4565419 (1986-01-01), Johnson et al.
patent: 4751421 (1988-06-01), Braun et al.
patent: 4990820 (1991-02-01), Suster et al.
patent: 5684355 (1997-11-01), Seredich et al.
patent: 5855430 (1999-01-01), Coushaine et al.
patent: 5921663 (1999-07-01), Flammer
patent: 5957569 (1999-09-01), Helbig et al.
patent: 6078136 (2000-06-01), Sica
patent: 6080019 (2000-06-01), Coushaine
patent: 6536929 (2003-03-01), Forgacs et al.
patent: 7559685 (2009-07-01), Rosenmuller et al.
patent: 7573184 (2009-08-01), Ngai et al.
patent: 2318850 (2000-08-01), None
patent: 10023429 (2001-04-01), None
Flechsig Jürgen
Müller Gert
Rosenmüller Peter
Trampler Andreas
Koninklijke Philips Electronics , N.V.
Roy Sikha
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