Lamination-wound chip coil and method for manufacturing the same

Inductor devices – Winding with terminals – taps – or coil conductor end...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

336200, 336221, H01F 1510, H01F 1704

Patent

active

045742626

ABSTRACT:
A lamination of a resilient and elongate magnetic sheet and a conductor strip is rolled up around a magnetic winding core to form a roll, and then the roll is sintered to produce an intermediate product. The conductor strip has both ends at both sides of the magnetic sheet so that both ends of the conductor strip are respectively exposed at both sides of the roll. Terminal electrodes are respectively attached to the both sides of the intermediate product to complete the chip coil. Another magnetic sheet may be provided to make the thickness of the lamination substantially uniform throughout the entire area. A second conductor strip may be provided in the lamination so that a coil having a tap can be actualized. The shrinkages of the winding core and the magnetic sheet are selected so that a desirable sintered product will result without suffering from delamination or cracks. The electrical characteristics of the coil may be changed by varying the amounts of components and changing additives in each of the materials respectively used for the winding core and the magnetic sheet.

REFERENCES:
patent: 2874360 (1959-02-01), Eisler
patent: 3333334 (1967-08-01), Kuliczkowski et al.
patent: 3466586 (1969-09-01), Bull et al.
patent: 3988665 (1976-10-01), Neumaier et al.
patent: 4056800 (1977-11-01), Dionne et al.
patent: 4383235 (1983-05-01), Layton et al.
patent: 4456900 (1984-06-01), Toyoshima et al.
IBM Technical Disclosure Bulletin; vol. 15, No. 2, Jul. 1972, p. 363, O'Donnell, Jr., R. T.; "Flat Circuit Coil."
IBM Technical Disclosure Bulletin, vol. 16, No. 9, Feb. 1974, N. T. Gonnella et al., "Flexible Circuit Solenoid", p. 3008.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lamination-wound chip coil and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lamination-wound chip coil and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lamination-wound chip coil and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1596127

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.