Lamination process for producing non-planar substrates

Details Lamination process for producing non-planar substrates Lamination process for producing non-planar substrates

1995-06-02

1997-07-08

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 89, 156252, 156268, 1562728, 1562751, 156278, 156 69, 156248, B32B 3118, B32B 3112

Patent

active

056456735

ABSTRACT:
Forming a green multi-layer component with an embedded pattern of barrier material, which may be in the form of a positive pattern to form a recessed area or in the form of a negative pattern to form raised areas on the component. Peripheral channels are machined into the green laminate surface to outline each negative or positive pattern feature, the channels being cut deep and wide enough to contact and overlap the edges of the barrier material. The layer of barrier material and the overlying layer(s) of ceramic material are separated from the remainder of the component to produce a non-planar part having raised areas in the case of a negative pattern of barrier material or a part having recessed areas in the case of a positive pattern of barrier material. An apparatus and process to control the machining depth of cut using both AC and DC sensing techniques is disclosed. The non-planar component may be provided with recessed surface metallurgy, such as seal bands and filled via connections, which can survive planarization.

REFERENCES:
patent: 4837408 (1989-06-01), Kondo et al.
patent: 5176771 (1993-01-01), Bravo et al.
patent: 5240671 (1993-08-01), Carey et al.
patent: 5435875 (1995-07-01), Saitoh et al.
patent: 5478420 (1995-12-01), Gauci et al.

Affiliated with

Also associated with

Rating

Lamination process for producing non-planar substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lamination process for producing non-planar substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lamination process for producing non-planar substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2407055