Lamination of liquid crystal polymer dielectric films

Details Lamination of liquid crystal polymer dielectric films Lamination of liquid crystal polymer dielectric films

2002-10-03

2004-11-16

Ton, Toan (Department: 2871)

Liquid crystal cells, elements and systems

Particular structure

Having significant detail of cell structure only

C349S187000, C349S073000

Reexamination Certificate

active

06819373

ABSTRACT:

TECHNICAL FIELD
The present invention relates to lamination of liquid crystal polymer (LCP) dielectric films to form multilayer laminate structures.
RELATED ART
Organic substrates comprising multilayer laminates have been and continue to be developed for many applications. However, it would be desirable to reduce costs and inefficiencies that currently characterize fabrication of multilayer laminates.
SUMMARY OF THE INVENTION
In first embodiments, the present invention provides a multi-layered structure, comprising:
a first layer; and
a second layer, wherein the first layer comprises a first liquid crystal polymer (LCP) dielectric material, and wherein the first layer is bonded to the second layer such that the first LCP material is directly bonded to the second layer with no extrinsic adhesive material bonding the first LCP material to the second layer.
In second embodiments, the present invention provides a method of making a multi-layered structure, comprising the steps of:
generating a page including stacking N substructures in an ordered sequence such that N is at least 2, wherein a first substructure of each pair of adjacent substructures comprises liquid crystal polymer (LCP) dielectric material to be bonded with a second substructure of said pair of adjacent substructures; and
subjecting the page to a temperature less than the lowest nematic-to-isotropic transition temperature of the LCP dielectric materials within the page, for a dwell time and at an elevated pressure that is sufficient to cause all LCP dielectric material within the page to plastically deform and laminate each pair of adjacent substructures without any extrinsic adhesive layer disposed between the first and second substructures of each pair of adjacent substructures.
The present invention advantageously reduces processing time and processing costs, and reduces dielectric layer thickness, in the fabrication of multilayer laminates.


REFERENCES:
patent: 6093344 (2000-07-01), Park et al.
patent: 6433843 (2002-08-01), Okada et al.
patent: 6532046 (2003-03-01), Yamashita et al.

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