Laminating type molded coil

Details Laminating type molded coil Laminating type molded coil

1994-06-17

1997-07-29

Stanzione, Patrick J.

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

336205, H01F 500

Patent

active

056525613

ABSTRACT:
A laminating type molded coil and a method of fabricating the same comprising at least one coil substrate structure in which coils are formed on both sides of an insulating substrate by use of a printed wire technique, resin sheets disposed on both side of the coil substrate structure, and insulating covering sheets disposed on the outermost surfaces of the resin sheets, wherein when heated and subjected to pressure the spaces between the layers and between the coils are filled with resin from the resin sheets, and then hardened to produce an integral structure. Advantageously, because the coil pattern has a predetermined shape and is formed by printed wire techniques, the thickness of the coils may be thin and the gaps between the coils may be narrow. By using the invention method, the fabrication does not require use of a molding box as does the conventional method and the fabrication is done with simple steps.

REFERENCES:
patent: 5392019 (1995-02-01), Ohkubo
patent: 5398400 (1995-03-01), Breen
patent: 5402098 (1995-03-01), Ohta et al.
patent: 5430424 (1995-07-01), Sato et al.
patent: 5461353 (1995-10-01), Eberhardt
patent: 5463365 (1995-10-01), Iwatani et al.
patent: 5487214 (1996-01-01), Walters

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