Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent
1980-05-06
1982-05-04
Kimlin, Edward C.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
156267, 156510, 156252, 425292, 425395, 72326, 83514, 83519, 156253, 156530, B32B 3100, A01J 2102, A21C 300, B26D 102
Patent
active
043280676
ABSTRACT:
Shaped and self-supporting stratiform laminates, such as inner door panels for automobiles, are produced from a thermoplastic substrate and a flexible sheet material in a one-stroke molding, laminating, and cutting operation; laminated products obtained have protruding free edge portions of the flexible coating sheet so that cut edge portions of substrate can be covered subsequently with the protruding free portions.
Apparatus for producing such laminates is a molding press having two molding plates, each of which includes one component of a pair of cutting means; the other two components of the pair of cutting means are provided by a generally annular element that is movable relative to the molding plates; the annular element includes a surface for cooperation with a peripheral knife around the surface of the upper molding plate to form one cutting means, and a cutting edge for cooperation with a shearing edge of the lower molding plate to form the second cutting means.
REFERENCES:
patent: 2482981 (1949-09-01), Kamrass
patent: 3234774 (1966-02-01), Margedant
patent: 4104349 (1978-08-01), Hillgenberg
Falasco Louis
G.O.R. Applicazioni Speciall S.p.A.
Kimlin Edward C.
LandOfFree
Laminating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laminating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminating method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-880581