Laminates from epoxidized phenol-hydrocarbon adducts

Details Laminates from epoxidized phenol-hydrocarbon adducts Laminates from epoxidized phenol-hydrocarbon adducts

1987-01-20

1987-12-01

Nielsen, Earl

Stock material or miscellaneous articles

Composite

Of epoxy ether

428285, 428901, 525523, 528 97, 528 98, 528106, C08G 5904, C08G 5932

Patent

active

047104295

ABSTRACT:
Laminates are prepared for reinforced expoxy resin compositions comprising (A) a reinforcing material such as fiberglass, (B) one or more epoxy resins such as a hydrocarbon-phenol eposy resin and (C) one or more epoxy resin curing agents such as a hydrocarbon-phenol resin or phenol-formaldehyde novolac resin. These laminates are particularly suitable for use in electrical applications such as the manufacture of printed circuit boards.

REFERENCES:
patent: 3264358 (1966-08-01), Webb et al.
patent: 3384617 (1968-05-01), Casale et al.
patent: 3419624 (1968-12-01), Cotter
patent: 3536734 (1970-10-01), Vegter et al.
patent: 4167542 (1979-09-01), Nelson
patent: 4211715 (1980-07-01), Kanagawa et al.
patent: 4390680 (1983-06-01), Nelson
patent: 4394497 (1983-07-01), Nelson et al.
Article in a Japanese trade newspaper, The Kagaku Kogyo Daily, Mar. 23, 1985, entitled "Electronics Related Materials Entered the Second Stage/Dipp Epoxy, Originally Developed Material, Reached the Goal".

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