Laminates for printed circuit boards

Details Laminates for printed circuit boards Laminates for printed circuit boards

1982-03-03

1983-10-04

Ives, P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428415, 428416, 428417, 428436, 428458, 428460, 4284735, 428901, 428273, 1563073, 156330, B32B 2734

Patent

active

044078838

ABSTRACT:
Laminates for printed circuit boards may comprise a metal-covered, relatively thin high temperature-resistant barrier material bonded to at least one side of a core material, the temperature resistance of the barrier layer being greater than that of the core. An example of the laminate will comprise a core material comprising an epoxy/glass laminate to which is bonded on both sides a barrier layer comprising a polyimide resin, said polyimide resin having a copper foil on the outer surface thereof. The laminates may be prepared by laying up a metal-clad high temperature-resistant barrier which has been fully cured on the core material followed by lamination of the composite at a temperature in the range of from about 150.degree. F. to about 450.degree. F. and a pressure in the range of from about 100 to about 1200 psi.

REFERENCES:
patent: 3958317 (1976-05-01), Peart et al.
patent: 3985928 (1976-10-01), Watanabe et al.
patent: 4104438 (1978-08-01), Angelo et al.

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