Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Encapsulated
Reexamination Certificate
2007-08-28
2007-08-28
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
Encapsulated
C257S414000
Reexamination Certificate
active
11171826
ABSTRACT:
An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic LEDs.
REFERENCES:
patent: 4287285 (1981-09-01), Mosehauer
patent: 4501637 (1985-02-01), Mitchell et al.
patent: 4720432 (1988-01-01), Van Slyke et al.
patent: 4746392 (1988-05-01), Hoppe
patent: 4767679 (1988-08-01), Kawachi
patent: 5022554 (1991-06-01), Heeter et al.
patent: 5276381 (1994-01-01), Wakimoto et al.
patent: 5408109 (1995-04-01), Heeger et al.
patent: 5693956 (1997-12-01), Shi et al.
patent: 5742129 (1998-04-01), Nagayama et al.
patent: 5781169 (1998-07-01), Kujik et al.
patent: 5804917 (1998-09-01), Takahashi et al.
patent: 5844363 (1998-12-01), Gu et al.
patent: 5920080 (1999-07-01), Jones
patent: 6069443 (2000-05-01), Jones et al.
patent: 6175186 (2001-01-01), Matsuura et al.
patent: 6198217 (2001-03-01), Suzuki et al.
patent: 6268695 (2001-07-01), Affinito
patent: 6278237 (2001-08-01), Campos
patent: 6309901 (2001-10-01), Tahon et al.
patent: 6592969 (2003-07-01), Burroughes et al.
patent: 6600175 (2003-07-01), Baretz et al.
patent: 6949825 (2005-09-01), Guenther et al.
patent: 2585510 (1987-01-01), None
patent: 2028719 (1980-03-01), None
patent: 58-39075 (1983-03-01), None
patent: 155504 (1991-04-01), None
patent: 449938 (2001-08-01), None
patent: WO01/04938 (2001-01-01), None
patent: WO01/04963 (2001-01-01), None
Burroughs, J.H. et al., “Light-emitting diodes bases on conjugated polymers”, Nature vol. 347, Oct. 11, 1990, 539.
Harper, Charles A., “Electronics Packaging and Interconnection Handbook”, © 1991, McGraw-Hill, Inc., pp. 1.22-1.23, 1.40-1.42.
Chua Soo Jin
Guenther Ewald Karl Michael
Wang Wei
Andújar Leonardo
Fish & Richardson P.C.
Institute of Materials Research and Engineering
OSRAM Opto Semiconductors GmbH & Co. oHG
LandOfFree
Laminates for encapsulating devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laminates for encapsulating devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminates for encapsulating devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3834832