Stock material or miscellaneous articles – Composite – Of silicon containing
Patent
1991-03-14
1999-12-21
Kiliman, Leszek
Stock material or miscellaneous articles
Composite
Of silicon containing
428447, 428448, 523212, 524264, 524265, 524588, 524730, 524731, 524860, 524861, 524862, 524863, 525474, 528 10, 528 31, 528 32, B32B 904
Patent
active
060046791
ABSTRACT:
A multilayer laminate having improved peel strength and containing a first and third layer comprising various plastic, metal, or glass materials, and a second layer containing an addition-curable silicone composition curable to form an adhesive having good physical properties and improved peel adhesion properties, the second layer comprising (A) a vinyl-containing polydiorganosiloxane composition, (B) a hydrogen-terminated polysiloxane, preferably in an amount sufficient to provide an adhesion-promoting molar ratio of silicon-bonded hydrogen atoms in (B) to olefinically unsaturated radicals in (A); (C) a catalytic amount of a platinum-containing hydrosilation catalyst; (D) an effective amount of an adhesion promoter selected from the group consisting of (i) bis[3-(trimethoxysilyl)alkyl]-fumarates; (ii) bis[3-(trimethoxysilyl)alkyl]maleates; (iii) allyl-[3-(trimethoxysilyl)alkyl]maleates; (iv) allyl-[3-(trimethoxysilyl)alkyl]fumarates; and (v) N-[3-(trimethoxysilyl) alkyl]maleimides, wherein R.sup.2, R.sup.3, and R.sup.4 are each alkyl radicals of 1 to about 8 carbon atoms; and (E) from about 0 to about 200 parts of an extending filler; and (F) from about 0 to about 50 parts of a reinforcing filler.
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Chemical Abstracts, vol. 99, No. 16, Oct. 17, 1982, Columbus, OH, US; abstract No. 123750W, Flexible printed circuit boards. P. 55; abstract & JP-A-58 021 893 (Sumitomo Bakelite Co., Ltd. & Toshiba Silicone Co., Ltd.( Feb. 8, 1983.
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Davis Mark Wayne
Kerr, III Stuart Robert
Mitchell Tyrone Duncan
Bugbee Michelle
General Electric Company
Kiliman Leszek
Wheelock Kenneth S.
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