Laminated wiring board and its mounting structure

Details Laminated wiring board and its mounting structure Laminated wiring board and its mounting structure

2007-06-05

2007-06-05

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C174S255000, C174S258000, C174S260000, C174S261000, C174S264000, C257S684000, C257S703000, C361S760000, C361S762000

Reexamination Certificate

active

10902677

ABSTRACT:
A laminated wiring board comprising:a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; anda second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate;the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes;wherein a coefficient α1of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient α2of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions:in-line-formulae description="In-line Formulae" end="lead"?α1<α2in-line-formulae description="In-line Formulae" end="tail"?in-line-formulae description="In-line Formulae" end="lead"?α2−α1≦9×10−6/° C.in-line-formulae description="In-line Formulae" end="tail"?The laminated wiring board offers a high degree of mounting reliability even when it is interposed between the electric device such as a silicon semiconductor device having a small coefficient of thermal expansion and an external circuit board such as a printed board having a large coefficient of thermal expansion.

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