Telecommunications – Transmitter and receiver at same station – With transmitter-receiver switching or interaction prevention
Reexamination Certificate
2006-04-11
2006-04-11
Vuong, Quochien B. (Department: 2682)
Telecommunications
Transmitter and receiver at same station
With transmitter-receiver switching or interaction prevention
C455S078000, C455S553100, C333S132000, C333S101000
Reexamination Certificate
active
07027779
ABSTRACT:
A laminated high-frequency switch module for selecting either a transmission circuit or a reception circuit of each of transmission/reception systems by switching, comprising a demultiplexer for demultiplexing signals of the transmission/reception systems, high-frequency switch circuits for selecting either the signal path of a reception signal from the demultiplexer to the reception circuit or the signal path of a transmission signal from the transmission circuit to the demultiplexer, and circuit for measuring the power of the transmission signal from the transmission circuit, characterized in that the laminate is composed of dielectric layers having electrode patterns, and the demultiplexer, the high-frequency switch circuits, and the power measuring circuit are constituted of electrode patterns in the laminate.
REFERENCES:
patent: 5473293 (1995-12-01), Chigodo et al.
patent: 5507011 (1996-04-01), Chigodo et al.
patent: 6606015 (2003-08-01), Uriu et al.
patent: 6683512 (2004-01-01), Nakamata et al.
patent: 6867662 (2005-03-01), Uriu et al.
patent: 2002/0101296 (2002-08-01), Uriu et al.
patent: 2002/0183016 (2002-12-01), Kemmochi et al.
patent: 2005/0134402 (2005-06-01), Uriu et al.
patent: 2005/0221769 (2005-10-01), Kemmochi et al.
patent: 0 785 590 (1997-07-01), None
patent: 0 837 516 (1998-04-01), None
patent: 0 921 642 (1999-06-01), None
patent: 11-225089 (1999-08-01), None
patent: 11-313003 (1999-11-01), None
T. Hideaki et al., “Coupler Containing Low Pass Filter”, Patent Abstracts of Japan of JP 11-220312 A, Aug. 10, 1999.
K. Shigeru et al., “Composite Switch Circuit Parts”, Patent Abstracts of Japan of JP 10-276117 A, Oct. 13, 1998.
O. Akira et al., “MMIC Package”, Patent Abstracts of Japan of JP 06-268532 A, Sep. 22,1994.
Kemmochi Shigeru
Tai Hiroyuki
Watanabe Mitsuhiro
Dao Minh D.
Finnegan Henderson Farabow Garrett & Dunner LLP
Hitachi Metals Ltd.
Vuong Quochien B.
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