Laminated thermally conductive substrate

Details Laminated thermally conductive substrate Laminated thermally conductive substrate

1990-05-29

1991-08-20

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174256, 361401, 428901, H05K 100

Patent

active

050416995

ABSTRACT:
The present invention discloses a laminated thermally conductive substrate for supporting microwave power amplifiers, having unique layering thicknesses with materials having similar thermal expansion characteristics, whereby the thermally conductive substrate experiences limited deflection during temperature cycling.

REFERENCES:
patent: 4609586 (1986-09-01), Jensen et al.
patent: 4876120 (1989-10-01), Belke et al.
patent: 4914551 (1990-04-01), Anschel et al.
"Thick Metal Cladding on RT/duroid Microwave Circuit Dielectric Laminates", by Rogers Corporation, RT 5.3.2. 8/87, pp. 1-6.

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