Laminated support structure for silicon printhead modules

Details Laminated support structure for silicon printhead modules Laminated support structure for silicon printhead modules

2006-01-10

2006-01-10

Nguyen, Thinh (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

06984021

ABSTRACT:
A printhead assembly for an ink jet printer that has an elongate support structure (1) that attaches to the printer and is adapted to accept a printhead (2) that mounts to the support member (1). The support member (1) is formed from a number of laminated materials (3, 4) having different coefficients of thermal expansion. The support member materials (3, 4) are selected and structurally configured so that the effective coefficient of thermal expansion of the support member as a whole substantially matches that of the silicon nozzle substrate material.

REFERENCES:
patent: 5528272 (1996-06-01), Quinn et al.
patent: 5894316 (1999-04-01), Sakai et al.
patent: 6250738 (2001-06-01), Waller et al.
patent: 6322206 (2001-11-01), Boyd et al.
patent: 6428145 (2002-08-01), Feinn et al.
patent: 6543880 (2003-04-01), Akhavain et al.
patent: 1 043 158 (2000-04-01), None
patent: 10128974 (1998-05-01), None
patent: 10181015 (1998-07-01), None
patent: WO 99/65690 (1999-12-01), None

Affiliated with

Also associated with

Rating

Laminated support structure for silicon printhead modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laminated support structure for silicon printhead modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminated support structure for silicon printhead modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3589771