Laminated structure of a metal layer on a conductive polymer lay

Details Laminated structure of a metal layer on a conductive polymer lay Laminated structure of a metal layer on a conductive polymer lay

1995-03-30

1997-04-15

Ryan, Patrick

Stock material or miscellaneous articles

Composite

Of metal

4284722, 428209, 427304, 427305, 174261, 174256, 156150, 156151, 205169, 205122, 205125, B32B 900

Patent

active

056208006

ABSTRACT:
A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 .OMEGA./square. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10.sup.6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7).
A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.

REFERENCES:
patent: 3793106 (1974-02-01), Grunwald et al.
patent: 5264108 (1993-11-01), Mayer et al.

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