Laminated structure of a metal layer on a conductive polymer lay

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428901, 526268, 526280, 526286, B32B 900

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054278414

ABSTRACT:
A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 .OMEGA./sqaure. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10.sup.6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7).
A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.

REFERENCES:
patent: 3984598 (1976-10-01), Sarazin et al.
"Influence of Chemicals Polymerization Conditions on the Properties of Polyaniline" Y. Cao et al, Polymer, 1989, vol. 30, Dec. 1989 pp. 2305-2311.
"The Application of Polypyrrole Precoat for the Metallization of Printed Circuit Boards" S. Gottesfeld et al, J. Electrochem. Soc. vol. 139, No. 1 Jan., 1992.

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