Laminated socket contacts

Details Laminated socket contacts Laminated socket contacts

2002-02-26

2003-06-10

Patel, Tulsidas (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S884000

Reexamination Certificate

active

06575766

ABSTRACT:

FIELD OF THE INVENTION
The invention relates generally to the field of integrated circuit socket design. More particularly, the invention relates to a laminated socket contact that reduces the inductance of the package/sockets by reducing the distance between power and ground conductors of the contact.
BACKGROUND OF THE INVENTION
Various methods of mounting integrated circuit packages onto printed circuit boards have been developed. For example, common methods employ some form of socket, mounted onto a printed circuit board, into which the integrated circuit package is placed. Pins on the integrated circuit package mate with corresponding receptacles in the socket. Through these pins, power, ground, input, and output signals are supplied to the integrated circuit.
Improvements to the various types of sockets used to mount integrated circuit packages have focused on reducing the amount of electrical resistance presented by the contacts within the sockets. Various improvements have focused on increasing the contact area and/or the contact pressure in order to provide low resistance connections.
However, the power and ground connection points of these various types of sockets are relatively far apart and the conductors carrying the current are relatively long. This distance between connection points and length of conductor increase the amount of inductance in the conductors.


REFERENCES:
patent: 3951495 (1976-04-01), Donaher et al.
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4089575 (1978-05-01), Grabbe
patent: 4814857 (1989-03-01), Werbizky
patent: 5104327 (1992-04-01), Walburn
patent: 6328574 (2001-12-01), Howell et al.
patent: 6392306 (2002-05-01), Khandros et al.

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