Laminated semiconductor assembly

Details Laminated semiconductor assembly Laminated semiconductor assembly

1985-02-19

1986-09-23

Davie, James W.

357 74, 357 76, 357 81, H01L 2316

Patent

active

046138927

ABSTRACT:
The problem of compensating for dimensional differences occuring in the length of adjacent stacks of semiconductors or other electronic components in an electrical assembly of such components is avoided through the use of a plurality of housing sections one for each stack with each housing section being comprised of stacked thin sheets of electrically conductive or electrically insulating material. Some of the sheets have cutouts to receive semiconductors. The stacks are tied together by ribbon-like flexible tabs integral with at least some of the sheets and interconnecting the housing sections. The tabs are constructed to be deformable generally independently of the other of the tabs.

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