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2006-11-14

2006-11-14

Cain, Edward J. (Department: 1714)

Compositions

Getters or gas or vapor generating materials for electric...

C252S181600, C252S189000, C252S192000

Reexamination Certificate

active

07135127

ABSTRACT:
A disk-shaped wafer is described which is based on an inorganic sorbent and a binder, with a thickness of less than 700 microns, which can be obtained by pressing a mixture of the inorganic sorbent, about 20 to 60% by weight of the binder and about 10 to 15% by weight water at a pressure of at least 70 MPa; and calcining the resulting green wafer at temperatures of at least about 500° C. until the water content is substantially removed.

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U.S. Appl. No. 10/040,794, filed Jan. 7, 2002, Dick et al.

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