Laminated polyphenylene sulfide film and process for producing t

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428419, 428910, B32B 2706, B32B 2728

Patent

active

053467620

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

This invention relates to a laminated polyphenylene sulfide film and a process for producing the same. More particularly, this invention relates to a laminated polyphenylene sulfide film which has excellent adhesiveness, particularly heatsealability, as well as excellent mechanical properties and heat resistance, and to a process for producing the same.


BACKGROUND ART

Polyphenylene sulfide films have excellent mechanical properties and heat resistance, so that various uses thereof are expected and have been proposed. For example, Japanese laid-open patent application (Kokai) No. 57-121052 discloses a non-oriented polyphenylene sulfide sheet, and Japanese laid-open patent application (Kokai) No. 54-142275 discloses a biaxially oriented polyphenylene sulfide film. Although the non-oriented sheets have high tear strengths, if they are exposed to a high temperature, their mechanical strengths are sharply decreased, and they have poor long term heat resistances. On the other hand, biaxially oriented films have much improved mechanical properties other than tear strength, and their chemical resistances and long term heat resistances are extremely high. However, as is apparent from the fact that they have excellent chemical resistances and heat resistances, since their surfaces are inert, they have poor adhesiveness. Therefore, in order to use them for wrapping, electrical insulation or for general industrial applications, it is necessary to give adhesiveness, particularly heatsealability.
As a method for promoting adhesiveness, it is known to perform corona discharge treatment (Japanese laid-open patent application (Kokai) No. 57-187327). However, with this method, although the adhesiveness is slightly improved, it is insufficient. Further, improvement in heatsealability is scarcely observed. It has also been proposed to apply an adhesive. However, not only does the adhesive per se have poor heat resistance, but also the deterioration of the adhesive by heat accelerates the deterioration of the polyphenylene sulfide film, so that the heat resistance is extremely poor.
To overcome the drawback of the biaxially oriented polyphenylene sulfide films that their tear strengths are poor, a film in which a copolymerization unit other than p-phenylene sulfide unit is copolymerized has been disclosed (Japanese laid-open patent application (Kokai) No. 61-98526). However, although the improvement in the tear strength of the film is observed, other mechanical properties are deteriorated.


DISCLOSURE OF THE INVENTION

An object of the present invention is to overcome these drawbacks in the prior art and to provide a polyphenylene sulfide film having excellent adhesiveness, particularly heatsealability, as well as good mechanical properties and heat resistance.
Another object of the present invention is to provide a process for producing the above-described polyphenylene sulfide film.
The present invention provides a laminated polyphenylene sulfide film comprising a biaxially oriented layer (layer B) consisting essentially of a biaxially oriented poly-p-phenylene sulfide film, and a surface layer (layer A) consisting essentially of a phenylene sulfide copolymer film in which at least one copolymerization unit other than p-phenylene sulfide unit is copolymerized with p-phenylene sulfide unit, which is laminated on at least one surface of the biaxially oriented layer, the resin compositions constituting said layers satisfying the following equations (1)-(4):
PPSF(A) means content of p-phenylene sulfide unit in layer A in terms of mol % with respect to the total repeating units in layer A;
PPSF(B) means content of p-phenylene sulfide unit in layer B in terms of mol % with respect to the total repeating units in layer B; and
COPF(A) means content of copolymerization unit in layer A, whose content is the second largest next to that of p-phenylene sulfide unit, in terms of mol % with respect to the total repeating units in layer A.
The present invention also provides a process for producing a laminated polypheny

REFERENCES:
patent: 4011121 (1977-03-01), Doss
patent: 5130181 (1992-07-01), Mutaguchi et al.

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