Laminated piezoelectric ceramic element manufacturing method

Details Laminated piezoelectric ceramic element manufacturing method Laminated piezoelectric ceramic element manufacturing method

2010-10-15

2011-11-22

Gray, Linda L (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089120, C156S512000, C029S025350

Reexamination Certificate

active

08062460

ABSTRACT:
There is provided a laminated piezoelectric ceramic element manufacturing method, wherein, even when the number of internal electrode laminations is increased, the lamination and cutting steps can be simplified, to enhance cutting precision and make cutting cost low. A first laminated body having stripe-like internal electrodes is cut into a plurality of second laminated bodies so as to have a width-direction dimension W corresponding to a width dimension of a laminated piezoelectric ceramic element chip to be ultimately obtained. Two or more second laminated bodies are laminated in the laminating direction to obtain a third laminated body, and the third laminated body is cut in the laminating direction and parallel to the width direction W to obtain a laminated piezoelectric body.

REFERENCES:
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patent: 2002-314161 (2002-10-01), None
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Written Opinion of the International Searching Searching Authority, mailed Apr. 7, 2009.

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