Laminated package

Details Laminated package Laminated package

2008-03-18

2008-03-18

Mack, Ricky (Department: 2873)

Optical: systems and elements

Optical modulator

Light wave temporal modulation

C359S290000

Reexamination Certificate

active

07345807

ABSTRACT:
A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package400taught has laminated layers forming the package substrate402and providing a precision reference plane416relative to the position of the micromirror device404. The package may be formed by laminating several layers of material in sheets to form several package substrates simultaneously. Voids formed in the layers408on one side of the reference plane provide access to the reference plane. A transparent cover or lid412is attached to the package substrate402sealing the micromirror404in the cavity410. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

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patent: 2004/0061492 (2004-04-01), Lopes et al.
patent: 09-199524 (1997-07-01), None

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