Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-07-15
1996-07-30
Thomas, Laura
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174257, 174258, 174262, 361760, 361762, H05K 109, H05K 103
Patent
active
055413684
ABSTRACT:
To facilitate the reworking of a multi-tiered circuit board and a laminated multi chip module, a chip module apparatus having a substrate portion is provided. The chip module has first and second opposite sides with vias extending therethrough. Deposited on both sides of the module by conventional processes is a layer of copper. A first mask is applied to the copper layer to expose a copper, electrical circuit pattern. A second mask having holes therein that are offset from the vias is placed over the first mask by conventional processes. Formed on at least one of the chip module's side in the second mask's holes are a spaced series of an solder BGAs, which have melting point temperatures substantially greater than the phase transition temperature of the chip module's substrate portion. The BGA's are formed on the chip module by an electrochemical plating process.
REFERENCES:
patent: 4706167 (1987-11-01), Sullivan
patent: 4979676 (1990-12-01), Dibugnara
patent: 5179501 (1993-01-01), Ocken et al.
patent: 5300461 (1994-04-01), Ting
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5319159 (1994-06-01), Watanabe et al.
Dell USA L.P.
Huffman James
Konneker Richard
Thomas Laura
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