Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-01-18
1997-03-18
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361735, 361790, 361792, 361777, 361803, 439 65, 439 75, 439 83, H01R 2372, H01R 909, H05K 111, H05K 702
Patent
active
056130333
ABSTRACT:
An interconnect system is provided in which one or more laminated modules embodying electrical devices can be stacked in a three dimensional configuration upon a printed circuit board. One or more electrical devices is surface mounted to a recessed area at the upper surface of each laminated module, and each laminated module includes male pins and female sockets. The male pins can be releasibly engaged within sockets upon a printed circuit board. Additionally, the male pins of one laminated module can be engaged within female sockets of another laminated module in building-block fashion. Conductive paths are formed entirely through the laminated module between respective sockets and pins. The conductive paths are arranged in a less dense fashion than bond locations adjacent each electrical device. The bond locations are therefore offset from conductive paths to provide fan-out and redistribution features.
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Kocis Tom J.
Swamy N. Deepak
Dell USA LP
Sparks Donald
Terrile Stephen A.
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